Dr. Eric Bogatin received his BS in physics from MIT and MS and PhD in physics from the University of Arizona in Tucson. He has held senior engineering and management positions at Bell Labs, Raychem, Sun Microsystems, Ansoft, and Interconnect Devices. Dr. Eric Bogatin has written four books on signal integrity and interconnect design and over 200 papers. His latest book "Signal Integrity-Simplified" was published in 2003 by Prentice Hall. He has taught over 4,000 engineers in the last 20 years. Read his monthly signal integrity column "No Myths Allowed", in Printed Circuit Design and Manufacturing Magazine. He is currently President of Bogatin Enterprises, providing signal integrity content for print and online media. Through live classes and web based online lectures, Bogatin Enterprises and its web presence, www.BeTheSignal.com, is setting the standard in signal integrity training.

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MICHAEL CARANO

Michael Carano is vice-president of Electrochemicals, Inc., a developer and provider of processes and materials for the fabrication of printed wiring boards. He has been involved in the printed wiring board industry for over 28 years. His primary focus is on metallization technologies, electroplating, solderable finishes, HDI and imaging processes. He also looks for new ways to increase the competitiveness of the North American printed wiring board industry. Mike is also involved in strategic planning and technology roadmap formulation and implementation. Carano has published over 65 technical articles and has presented numerous other papers throughout the world. He is the holder of nine U.S. patents and over 20 foreign patents covering a variety of topics including plating, metallization processes and pwb fabrication techniques. He is the past chairman of the IPC Suppliers Management Council and currently serves on the IPC Long Range Planning committee. Michael is also a member of the IPC Board of Directors and is serving second term. He holds a Bachelor’s degree in Chemistry from Youngstown State University where he has also completed two years of graduate school in polymer chemistry and has earned an MBA in International Marketing from Baker College. ;

Mr. Clifford has a BS in Chemical Engineering, and has worked in plastics development (Monsanto), electronics (Raychem and Memorex) and the aerospace industries (McDonnell, UTC and Lockheed Martin) for the last 35 years. His duties (most recently) at Lockheed Martin / Sunnyvale included assembly supplier qualification, quality verification of PWBs and CCAs, SMT process development, and deployment of MEMS, microvia, CSP and other new technologies into advanced designs and processes. Recent projects include major thermal-cycle and vibe-shock reliability programs on array packages, embedded passives and CTE-matched substrates. Clifford holds several patents, including solder-joint reliability, and has authored many papers on thermal-cycle testing, SPC, DOE, PWB QC and reliability, embedded passives, life-test statistics, outsource management and more.

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Werner Engelmaier has over 42 years’ experience in electronic packaging and interconnection technology. Known as ‘Mr. Reliability’ in the industry, he is the president of Engelmaier Associates, Inc., a firm providing consulting services on reliability, manufacturing and processing aspects of electronic packaging and interconnection technology. This consulting company provides services to OEMs, printed circuit board manufacturers, PWB subcontract assembly companies and such end users as telecommunications firms, computer companies and the military. Werner is sought out for his expertise in the areas of design for reliability, accelerated reliability testing, reliability prediction, design for manufacturability and quality, processing effects, and environmental stress screening for solder joints, plated-through holes, and dynamically used flexible circuitry. Prior to forming his own company in 1990, Mr. Engelmaier was on the technical staff of AT&T Bell Laboratories. During his 24 years at Bell Labs he dealt with many of the aspects involved in electronic packaging and interconnection technology. His efforts within the Bell System/AT&T ranged from R&D at Bell Labs to ‘fire-fighting’ at Western Electric. Mr. Engelmaier is the author of over 170 technical publications in a variety of fields related to Electronic Packaging and Interconnection Technology and has been awarded a number of patents in these areas. He has conducted numerous tutorial workshops at industry conferences.

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Dan Feinberg is President and CEO of Fein-Line Associates, Inc., a consulting firm focused on the electronic interconnect (printed wiring board) and assembly industries and a founding Partner in the Quantum Performance Group, LLC, a market research firm. Dan was formerly president of Morton Electronic Materials (MEM or Dynachem), a $220 million division of Morton International, Inc., and a group vice president of the parent company Morton International until its acquisition by Rohm and Haas in 1999.

Dennis (“Denny”) Fritz started his career in the printed circuit industry in 1972 as a technical service representative with DuPont’s Riston™ division. He went on to hold many assignments in his 19 years’ direct employment at MacDermid, Inc., including sales and marketing management in both printed circuit consumables and semiconductor photoresist. Since April 1998, Mr. Fritz has been an independent technology consultant exclusively to MacDermid, and is the company’s principal representative to the U.S. Institute of Printed Circuits. He heads the Alternate Surface Finishes committee of IPC and is editor of the “Organic Board Fabrication” section of the 2007 IPC Roadmap. Fritz was the principal contact for MacDermid’s participation in the NIST Embedded Passives Program and is involved with market and technology research at MacDermid. He holds a BS degree in Chemical Engineering from Rose Hulman Institute of Technology and an MBA degree in Marketing from the University of Delaware. He works from his home in Brookville, Indiana.

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Mr. Gamini has over 22 years of experience in RF and optical package design, operations, quality/reliability, and production test. He is currently the VP of Manufacturing and a co-founder of Aeluros, Inc. Previously he was the Director of Advanced Packaging with Sirenza Inc., developing RF wireless and high-speed networking semiconductor products. His experience prior to Sirenza includes Director of Advanced Packaging with Rambus, and various managerial and engineering positions at Pacific Monolithics and Pantronix. A novel RF package, “PM-SOP”(TM), designed from the ground up by Mr. Gamini has been in high-volume production for over a decade. He serves as a member of technical advisory boards of several companies including Invensense (MEMS gyros) and VT Silicon (RF semiconductors). In addition to Aeluros, he serves on the board of directors of Verticle (high-brightness LEDs) and Celerity Research (smart probe cards). Mr. Gamini obtained his B.S. degree in Computer Science and holds 5 U.S. patents.

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Steve Greathouse (formerly of Intel Corp.) is President of “Greathouse Solutions,” a packaging and board assembly consultant group. Steve has managed and completed reliability testing on numerous programs including the development and deployment of PLCCs, PQFPs, known good die (KGD), Plastic BGAs, Tape BGAs, High Thermal laminate BGAs, uBGA™ along with other Chip Scale Packages (CSPs), and other leading edge packaging technologies including MEMS and Optical components. Steve has conducted dozens of electronic packaging conferences and seminars, and has published many articles on technical topics related to semiconductor packaging, lead free packaging, and is currently teaching classes on Pb-free board and component marking methodology for international markets. Steve is currently on the SMTA technical committee, the chairman of the SMTA Internet committee, and the Vice President of Communications on the board of directors of the International SMTA.

Dr. Belgacem Haba

Happy Holden

Happy Holden is the Senior PCB Technologist for Mentor Graphic’s System Design Division in Longmont, Colo. He is responsible for advanced and next-generation printed circuit technology consulting for Mentor’s customers and MGC engineering. Prior to joining Mentor, he was the Advanced Technology Manager at Westwood Associates and Merix Corporations. He retired from Hewlett-Packard after over 28 years. Mr. Holden formerly managed Hewlett-Packard's application organizations in Taiwan and Hong Kong. His prior assignment with HP had been as director of PCB R&D. He holds degrees in Chemical Engineering and Computer Science. He is a member of the IPC, SMTA, IMAPS and the IEEE.

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Harvey Miller

As the creator of Fabfile Online, a proprietary database of the printed circuit fabrication industry, Mr. Miller analyzes interconnection and packaging from chip to box, assessing technology and business trends and impacts. His educational background includes a BS degree in Economics from the University of Michigan, Army Specialized Training in electrical engineering, and subsequent EE courses. He also spent 25 years as a component engineer for OEMs. Since 1975, Harvey has been an analyst and consultant.

Richard Otte

Mr. Otte has been the President & CEO of PROMEX INDUSTRIES INC since 1995. Prior to that he was the General Manager of AMP’s (now Tyco’s) Passive Fiber Optic Products Subsidiary in Palo Alto, CA. From 1987 to 1992, Mr. Otte was President of Advanced Packaging Systems, a Raychem business unit in San Jose, CA, that developed and sold microelectronic packaging solutions utilizing co-fired ceramic, thin film and planar optical waveguide technologies.

Dr. Alan Rae

Alan Rae has many years of experience in technology commercialization and international business. While with Cookson Group plc, he was instrumental in ensuring the success of startup and developed businesses, including structural ceramics, flame retardants, refractories, electronic ceramics and wafer plating systems. From 1999 to 2004, Dr. Rae was VP of Technology for Cookson Electronics, deeply involved in developing business opportunities for materials systems and equipment in silicon wafer fabrication, packaging, circuit board manufacture, circuit board assembly and recycling. He is Director of Research for iNEMI Inc. (the International Electronics Manufacturing Initiative), a member and past Chair of the JISSO North America Committee (facilitating electronics business worldwide by harmonizing technology roadmaps and standards), and a member of the Industrial Advisory Board of SMTA (the Surface Mount Technology Association). Rae is also a member of the ANSI-Accredited US TAG to ISO TC229 (Nanotechnologies). He holds a Bachelor's Degree from the University of Aberdeen and PhD and MBA degrees from the University of Newcastle upon Tyne. Rae is a member of the Royal Society of Chemistry and a Chartered Chemist.

Bernie Siegal

Bernie Siegal's first involvement in semiconductor thermal matters came in 1966 while working at Hewlett-Packard Associates (HPA), the microwave semiconductor group within HP. He and an associate developed a automated system for making thermal resistance measurements on microwave diodes and authored the feature article describing the method that appeared in the October 1967 issue of the HP Journal. From that beginning to today, Bernie has been an active participant in the semiconductor thermal measurement, modeling and management field.

Vern Solberg

Tony Vacca

Since 1998, Mr. Vacca has been an independent consultant, serving such clients as Cray Inc., SRC Computer Inc., Target Management, and MCNC. From 1996 to 1998, he was Sr. Director of Technology Development at Silicon Graphics Inc. In this role, studies of emerging hardware (packaging, PC Board, interconnect and thermal control) technologies as they applied to advanced high-performance computer systems were developed with the industry and various research agencies and universities. Vacca has also worked with partnerships established with government (DARPA and DOD) funding.

Henry Utsunomiya

Henry Utsunomiya is a globally recognized authority in high technology with experience in compound semiconductor wafer technology marketing as well as expertise in PBGA, MCM-L and other IC packaging substrate technologies. His very active 25 year career includes more than 10 years of involvement and experience in international electronics / semiconductor standards and forecasting committee activity with such industry association as IPC, SIA, EIAJ and JIEP. Mr. Utsunomiya is licensed by the Japanese Government as a small and medium enterprise business consultant and has continued in this activity since early 1999. He is also a member of the Jisso International Council and ITRS Roadmap committee and has been a key contributor to the Jisso Roadmap published by the EIAJ and JEITA since its first printing. His important contributions to the electronics industry have been recognized as he is a recipient of the IPC President’s Award.