Answer: Yes. It is anticipated that the technology will be adaptable for use in optoelectronic applications and the concept can be adapted to the integration of copper and photo optical channels for data transmission. It should be noted that the more benign lower-temperature process in development is more adaptable to thermally-vulnerable photonic and optoelectronic systems. Certain additional capabilities such as access / placement, positioning and alignment, transparency, etc could offer further advantages. The technology could help re-invigorate this optoelectronic industry, stalled since the collapse of 2001.