Answer: Yes, and beneficially, based on the benign nature of the processing and reduced thermal shock and profiles. The technology could have other bonus far-reaching impacts based on that same room temperature process potential. A range of prospective semiconductor materials have been identified and are available to varying degrees. Some have reportedly been excluded from consideration because of the thermal excursions expected in assembly. It is possible that this new process could open the door to a broader range of prospective semiconductor materials. As an example, a clear benefit to the optoelectronics industry is likely, because their components could be used with the process, avoiding the high temperatures encountered in conventional solder assembly … especially now that lead-free processing is seen to require some reflow profiles that are approaching 260 °C.