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Can the technology deal with misregistration, at placement and then during encapsulation should it occur?
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Answer: Yes. This is important. It is true that the familiar molten-film self-centering effect will not exist with the proposed process. As with conventional SMT processing, initial placement errors and damaged leads will be one of the improved technology’s processing challenges. It is expected that these issues will be resolved using careful rheological and dispense control, tack-films, smart optical pattern-recognition targeting, and/or adaptive point-point interconnect. In fact, it is expected that the improved process will prove superior, in that perfect coplanarity and positioning may not be required, in all situations, given the adaptive capability of subsequent plate-up steps.
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