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Is the process technology and structure appropriate for a variety of product types?

Answer: The technology will be useful for a wide range of applications of volume and complexity; from low volume/low complexity to high volume/high complexity, thru low-volume, high-complexity, highest reliability products. The first areas of interest will include consumer products, memory modules, phone modules, computer card modules, RFID and smart cards; and high reliability electronics for military, aerospace, under-the-hood, and medical applications. Beyond these conventional applications, improved products are envisioned to succeed also in flexible circuits, and curved-substrate products. While the first functional prototypes are simple LED circuits, it is anticipated that cell phones and military products could be leading candidates for product qualification and introduction, given their demands for high-reliability, high-density, thermal and mechanical-shock resistance, especially in the face of the current lead-free imperatives. See Appendix C for examples.

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