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Can the improved technology offer thermal management solutions?

Answer: Yes. This technology appears ideally suited for thermal management options. Heat spreaders, phase-change systems, heat-sinks, and even heat pipes can be placed directly on top of or between components prior to assembly and will become a part of the assembly itself. This is because there is no concern about getting cold solder joints as would be the case for standard processing. Many prospective solutions (such as integration of a heat spreader) can be designed-in early in parts engineering to take advantage of placement and proximity potential with the improved approach. Similarly, it is anticipated that the component package itself can be optimized (ie to bypass the solder ball placement step). Further, advanced materials development is proceeding elsewhere that will offer electrically-insulating encapsulants that also have high thermal conductivity, possibly enabling other thermal-management solutions.

Others in this Category

	Will the technology have any impact on the semiconductor industry?
	Is the process technology and structure appropriate for a variety of product types?
	Isn’t this too “blue-sky”? Doesn’t the technology require lots of invention and discovery before it can achieve commercial reality?
	What about connectors and sockets? Can they be added or connected to the assembly if needed?
	Will products built in this manner be Underwriters Laboratories (UL) certifiable?
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