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Can the improved technology accommodate all types of SMT packages?

Answer: Yes. Early prototypes were created using a range of components, various QFPs, TSOPs and QFNs. (see Appendix C photos). A second prototype was produced using BGAs which were planarized to become LGAs. An attractive feature of Verdant’s improved approach is its suitability for the LGA and QFN packages. These are attractive from a design perspective (high performance and high-density), but are also most prone to opens and solder-ball shorts, because of constrained solder-joint geometry and difficulty of inspection. The technology enables more separation to minimize shorts and/or additional routing clearance and topology. Verdant will work closely with package developers to define the types of package that will work best. A Southern California startup, Mirror Semiconductor, is developing a concept for IC packaging that will very likely be able to take synergistic advantage of the concepts proposed herein. The technology is also favorable for use with the advanced IC packaging concepts disclosed by SiliconPipe, Inc. That company’s OTT (Over or Off the Top) and SSP (Stair Step Package) concepts offer highest performance as well as lowest cost options available today. The new solution enables and is readily adaptable to interconnection of these cost-effective high-performance package technologies.

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