Search:     Advanced search
Knowledgebase Home / FAQs


Showing: 1-20 of 30    »»
Articles
 
document This seems like a very large and daunting task. Even if the industry accepts the ideas, won’t it take the industry a long time to adapt to this new way of manufacturing?
There will be many challenges ahead, of course, but the fundamental ideas behind the proposed approach builds on the proven ideas of many different...
document Build-up technologies require very high yields at each step. Is the technology mature enough to risk entire assemblies?
Answer: Yes. , used in substrate fabrication and the creation of high density interconnect (HDI) IC packages, is very mature. Moreover, some of...
document Are materials available that are suitable for encapsulation? Have any materials been qualified?
Answer: Yes. Several off-the shelf appear suitable. Requirements for encapsulants include dimensional stability, resist excessive shrinkage...
document Can the improved technology accommodate all types of SMT packages?
Answer: Yes. Early prototypes were created using a range of components, various QFPs, TSOPs and QFNs. (see Appendix C photos). A second prototype was...
document How critical is IC package lead coplanarity?
Answer: Coplanarity is important but it is not a “show stopper. Several lead conditioning options within the technology are available; the...
document ESD is a growing concern; can the technology provide solutions?
Answer: The answer is yes. Emerging technologies for ESD protection appear to be well-suited to circuit protection. A leading company in ESD...
document Have other solderless possibilities been explored?
 Answer: Yes. For years, with essentially no success. Uni-ax elastomeric connectors showed some niche promise but had difficulties. Conductive...
document Can the improved technology offer thermal management solutions?
Answer: Yes. This technology appears ideally suited for thermal management options. Heat spreaders, phase-change systems, heat-sinks, and even...
document Will multiple sources of the technology be available?
Answer: Yes, that is anticipated. In today’s manufacturing environment, to be qualified and accepted, any process must be available from more...
document Isn’t this too “blue-sky”? Doesn’t the technology require lots of invention and discovery before it can achieve commercial reality?
Answer: No. Based on decades of electronics assembly manufacturing experience, product configurations are well known, the core processes are...
document This looks a bit like some earlier IC packaging technologies. What’s the difference?
Answer: In the 1990s, an innovative team of engineers and scientists at GE created multi chip modules packages using blind vias and build up circuit...
document Will products built in this manner be Underwriters Laboratories (UL) certifiable?
Answer: Indications are favorable, although no submittals have been made at the time of this writing. Verdant’s technology is a departure...
document Is the process technology and structure appropriate for a variety of product types?
Answer: The technology will be useful for a wide range of applications of volume and complexity; from low volume/low complexity to high volume/high...
document Is the technology appropriate for X-Ray inspection?
Answer: Yes, should it be necessary or simply desired for what ever reason. The encapsulant will not obscure the image, and subsequent build-up steps...
document Will related industries be affected by this reverse order process technology?
Answer: Yes.The technology could eventually have a significant impact. Solder for electronics is a ~ $600 million annual market. This represents ~ 1%...
document Will the technology have any impact on the semiconductor industry?
Answer: Yes, and beneficially, based on the benign nature of the processing and reduced thermal shock and profiles. The technology could have other...
document Will this technology have an impact on electronic product design?
Answer: Yes. The solutions in development are expected to have a very positive effect on design, in that they have the ability to open routing...
document Can the technology facilitate high-density designs?
Answer: Absolutely. Using this reverse order process technology designs can be much higher-density, simply because surface catch-pads and...
document Can products designed in this manner offer electromagnetic interference (EMI) protection?
Answer: Yes. Improved designs can embody conductive elements (metallic coatings, screens, shields, etc) locally or spanning and covering the entire...
document How will the technology address the assembly of passives (chip-caps, chip resistors, MELFs, etc) and other packages, whose terminals are typically tin-lead solder-plated?
Answer: This is an important question and there is no definitive answer at this moment. While there in nothing intrinsic in solder that would inhibit...


Powered by KBPublisher (Knowledge base software)