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This seems like a very large and daunting task. Even if the industry accepts the ideas, won’t it take the industry a long time to adapt to this new way of manufacturing?
There will be many challenges ahead, of course, but the fundamental ideas behind the proposed approach builds on the proven ideas of many different...
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Build-up technologies require very high yields at each step. Is the technology mature enough to risk entire assemblies?
Answer: Yes. , used in substrate fabrication and the creation of high density interconnect (HDI) IC packages, is very mature. Moreover, some of...
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How will the technology address the assembly of passives (chip-caps, chip resistors, MELFs, etc) and other packages, whose terminals are typically tin-lead solder-plated?
Answer: This is an important question and there is no definitive answer at this moment. While there in nothing intrinsic in solder that would inhibit...
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Have other solderless possibilities been explored?
Answer: Yes. For years, with essentially no success. Uni-ax elastomeric connectors showed some niche promise but had difficulties. Conductive...
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Can the technology facilitate high-density designs?
Answer: Absolutely. Using this reverse order process technology designs can be much higher-density, simply because surface catch-pads and...
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